Plating Nikel pada Kawat Tembaga untuk Meningkatkan Kepekaan sebagai Sensor Suhu Rendah

Authors

  • Siti Zahra Helmalia Putri Zahra Universitas Ahmad Dahlan
  • Moh. Toifur Universitas Ahmad Dahlan

DOI:

https://doi.org/10.30599/jipfri.v9i1.3402

Keywords:

Cu/Ni Coil, Electroplating, Low Temperature Sensor

Abstract

This research aims to determine the sensitivity of the sensor as a low temperature sensor from the Ni-coated Cu coil with electroplating technique. The deposition parameters are set, namely the electrolyte solution by dissolving NiSO4, NiCl2, H3BO4 and distilled water, voltage 4.5V, electrode distance 4 cm, electrolyte temperature 60 ° C for 4 minutes. The sensor sensitivity test was carried out by varying the temperature from 0˚C to -150˚C by inserting the sensor in a liquid nitrogen thermos and lifting it to its original position. Acquisition of temperature and voltage data at any time was carried out with the help of a transducer. Based on the results of the study, the Voltage-Temperature curve shows that the sensitivity value obtained by the Cu coil is S(T) = -1E-06 T - 5E-05 and the Cu/Ni coil S(T) = -4E-06 T - 0.0002. The results of the T=-200 ˚C projection show that the sensitivity value of the Cu/Ni coil has a greater value than the Cu coil. The Cu coil shows a value of 0.00035 while the Cu/Ni coil is 0.0014. So Ni has an effect on increasing the sensitivity of the Cu coil as a low temperature sensor.

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References

Aminur, Sudarsono, Hasanudin, L., Salimin, Kadir, A., Sudia, B., & Saputra, J. S. D. (2022). Aplikasi Pelapisan Nikel Pada Aluminium Dengan Proses Elektroplating. Jurnal Fokus Elektroda: Energi Listrik, Telekomunikasi, Komputer, Elektronika Dan Kendali), 7(4), 255–259. https://doi.org/10.33772/jfe.v7i4.35

Asroni, A., Budiyanto, E., Wahyudi, T. C., & Suarca, I. W. (2021). Pengaruh temperatur elektrolit terhadap ketebalan dan kuat lekat baja karbon rendah pada proses elektroplating. Turbo : Jurnal Program Studi Teknik Mesin, 10(2), 272–278. https://doi.org/10.24127/trb.v10i2.1755

Asroni, A., Handono, S. D., Wahyudi, T. C., & Saputra, Y. (2021). Pengaruh pH larutan elektrolit terhadap kuat lekat dan ketebalan hasil elektroplating bahan baja karbon rendah. Turbo : Jurnal Program Studi Teknik Mesin, 10(1). https://doi.org/10.24127/trb.v10i1.1593

Bikarregi, A., Dominguez, S., Brizuela, M., Alejandra, L., Suarez-vega, A., Agust, C., Presa, M., & Gabriel, A. L. (2023). Direct Fabrication of a Copper RTD over a Ceramic-Coated Stainless-Steel Tube by Combination of Magnetron Sputtering and Sol – Gel Techniques. Sensors, 23(12), 5442. https://doi.org/10.3390/s23125442

Fiqry, R., Toifur, M., Khusnani, D. A., Program, M., Pendidikan, S. M., Program, F., & Uad, P. (2018). Ketebalan Dan Nilai Resitivitas Lapisan Tipis Cu/Ni/Cu/Ni Hasil Penumbuhan Dengan Metode Elektroplating Pada Variasi Tegangan Deposisi (V). In PROSIDING SEMINAR NASIONAL & INTERNASIONAL (Vol. 1, No. 1).

Hamidun, E., & Toifur, M. (2019). Pembuatan Lapisan Cu / Ni pada Variasi Waktu Deposisi Berbantuan Medan Magnet. 1–5.

Jiwatami, A. M. A. (2022). Aplikasi Termokopel untuk Pengukuran Suhu Autoklaf. Lontar Physics Today, 1(1), 38–44. https://doi.org/10.26877/lpt.v1i1.10695

Noor Santi, W., Moh Toifur, Ss., Widodo, Ms., & Okimustava, Ms. (2020). Sintesis Lapisan Tipis Cu/Ni dengan Metode Elektroplating Berbantuan Medan magnet luar Sejajar Arus Ion. Penerbit K-Media: Yogyakarta

Singgih, S., & Toifur, M. (2020). Pengukuran Nilai Resistivitas Plat Tipis Cu-Ni Hasil Elektroplating Variasi Konsentrasi Suhu Rendah Berbasis Resistance Temperature Detector (RTD). In Prosiding Seminar Nasional Fisika dan Pendidikan Fisika..

Taufiqurrahman, M., Toifur, M., Ishafit, I., & Khusnani, A. (2020). Investigation on Effect of Solution Temperature on The Structure of Cu/Ni Layer in The Electroplating Assisted withParallel Magnetic Field. Journal of Aceh Physics Society, 9(3), 59–64. https://doi.org/10.24815/jacps.v9i3.16351

Taufiqurrahman, M., Toifur, M., Ishafit, Okimustava, & Khusnani, A. (2020). Effect of Solution Temperature on Voltage Range and Sensitivity of Low- Temperature Sensor Cu/Ni Results From Electroplating Assisted By Parallel Magnetic Fields. International Journal of Advanced Research in Engineering and Technology (IJARET). 11(10), 333–341. https://doi.org/10.34218/IJARET.11.10.2020.035

Toifur, M., & Islamiyati, R. N. (2024). Effect of 30˚C Electrolyte Temperature on The Sensitivity Cu/Ni. Spektra: Jurnal Fisika Dan Aplikasinya, 9(1), 1–10. https://doi.org/10.21009/spektra.091.01

Toifur, M., Yuningsih, Y., & Khusnani, A. (2018). Microstructure, thickness and sheet resistivity of Cu/Ni thin film produced by electroplating technique on the variation of electrolyte temperature. Journal of Physics: Conference Series, 997(1), 0–10. https://doi.org/10.1088/1742-6596/997/1/012053

Toifur, M., & Zulfana, D. (2022). Pembuatan Sensor Suhu Berbahan Kawat Kumparan dengan Indikator Intensitas Cahaya. JIPFRI (Jurnal Inovasi Pendidikan Fisika dan Riset Ilmiah), 6(2), 72-78. https://doi.org/10.30599/jipfri.v6i2.1707.

Wijanarko, N., Asroni, A., & Budiyanto, E. (2021). Pengaruh waktu pelapisan terhadap ketebalan dan kuat lekat pada baja karbon rendah dengan proses elektroplating. ARMATUR : Artikel Teknik Mesin & Manufaktur, 2(2), 67–75. https://doi.org/10.24127/armatur.v2i2.1445

Wustha, J., Toifur, M., & Khusnani, A. (2019). Thickness and Resistivities of Cu/Ni Film Resulted by Electroplating on the Various Electrolyte Temperature. Journal of Physics: Conference Series, 1373(1). https://doi.org/10.1088/1742-6596/1373/1/012029

Zeng, Y. Z., Zhou, F., & Gao, Y. (2023). Bi2O3 modified TiO2 nanotube arrays and their application towards unsymmetrical dimethylhydrazine degradation in wastewater by electroassisted photocatalysis. RSC Advances, 13(5), 2993–3003. https://doi.org/10.1039/d2ra05953c

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Published

2025-06-07

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Articles

How to Cite

Plating Nikel pada Kawat Tembaga untuk Meningkatkan Kepekaan sebagai Sensor Suhu Rendah. (2025). JIPFRI (Jurnal Inovasi Pendidikan Fisika Dan Riset Ilmiah), 9(1), 24-30. https://doi.org/10.30599/jipfri.v9i1.3402

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